ENTHONE INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 3617
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 2675
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 20342
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 1770
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 531
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 5151
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM4153
 
  
 
H01B CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES 470
 
  
 
C07C ACYCLIC OR CARBOCYCLIC COMPOUNDS 3135
 
  
 
C09D COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR 389

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0029,972 Copper Electrodeposition in MicroelectronicsOct 12, 16Feb 02, 17[C25D, H01L]
2016/0032,479 ELECTRODEPOSITION OF SILVER WITH FLUOROPOLYMER NANOPARTICLESMar 14, 14Feb 04, 16[C25D]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9617644 Method for direct metallization of non-conductive substratesMar 21, 11Apr 11, 17[C23C, C25D]
9538665 Process for electroless copper deposition on laser-direct structured substratesOct 10, 12Jan 03, 17[C23C, B05D, H05K]
9493884 Copper electrodeposition in microelectronicsDec 17, 13Nov 15, 16[C25D, H01L]
9338896 Adhesion promotion in printed circuit boardsJul 25, 12May 10, 16[C23C, B05D, C23G, C23F, H05K]
9249513 Beta-amino acid comprising plating formulationFeb 24, 15Feb 02, 16[C23C, C07C]
9222188 Defect reduction in electrodeposited copper for semiconductor applicationsJan 08, 08Dec 29, 15[C25D, H01L, H05K]
9222189 Method for the post-treatment of metal layersNov 13, 09Dec 29, 15[C25D, C09D]
9217205 Electrolytic deposition of metal-based composite coatings comprising nano-particlesDec 10, 08Dec 22, 15[C25D]
9212427 Cyanide-free electrolyte composition, and method for the deposition of silver or silver alloy layers on substratesOct 09, 07Dec 15, 15[C25D]
9175400 Immersion tin silver plating in electronics manufactureOct 28, 09Nov 03, 15[C23C]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0281,251 Electrodeposition of CopperAbandonedNov 25, 14Sep 29, 16[C25D, H01L, H05K]
2014/0158,545 APPARATUS FOR ELECTROCHEMICAL DEPOSITION OF A METALAbandonedJul 20, 12Jun 12, 14[C25D]
2014/0154,525 AQUEOUS SOLUTION AND METHOD FOR THE FORMATION OF A PASSIVATION LAYERAbandonedFeb 23, 12Jun 05, 14[C23C, B05D]
2013/0130,056 CORROSION-PROTECTIVE WAX COMPOSITION CONTAINING POLYANILINE IN A DOPED FORM AND A LIQUID PARAFFINAbandonedMar 21, 11May 23, 13[C09D]
2012/0298,519 ELECTROLYTE AND PROCESS FOR DEPOSITING A MATT METAL LAYERAbandonedJun 04, 12Nov 29, 12[C25D]
2012/0168,075 ADHESION PROMOTION OF METAL TO LAMINATE WITH MULTI-FUNCTIONAL MOLECULAR SYSTEMAbandonedMar 23, 09Jul 05, 12[C09J]
2011/0279,991 SOLDERABILITY ENHANCEMENT BY SILVER IMMERSION PRINTED CIRCUIT BOARD MANUFACTUREAbandonedJul 20, 11Nov 17, 11[B05D, C09D, H05K]
2011/0233,065 ELECTROLYTE AND METHOD FOR DEPOSITION OF MATTE METAL LAYERAbandonedJul 08, 09Sep 29, 11[C25D]
2011/0198,226 METHOD FOR DEPOSITION OF HARD CHROME LAYERSAbandonedOct 22, 09Aug 18, 11[C25D]
2011/0192,638 SILVER IMMERSION PLATED PRINTED CIRCUIT BOARDAbandonedApr 22, 11Aug 11, 11[H05K]
2010/0319,572 CORROSION PROTECTION OF BRONZESAbandonedJun 18, 08Dec 23, 10[C09D]
2009/0324,804 METHOD AND DEVICE FOR COATING SUBSTRATE SURFACESAbandonedJan 26, 07Dec 31, 09[B05C, B05D]
2009/0155,468 METROLOGY IN ELECTROLESS COBALT PLATINGAbandonedDec 17, 07Jun 18, 09[B05D]
2009/0145,764 COMPOSITE COATINGS FOR WHISKER REDUCTIONAbandonedDec 11, 07Jun 11, 09[C25D]
2008/0261,071 Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic ComponentsAbandonedJan 21, 05Oct 23, 08[C25D, B32B]
2008/0254,205 SELF-INITIATED ALKALINE METAL ION FREE ELECTROLESS DEPOSITION COMPOSITION FOR THIN CO-BASED AND NI-BASED ALLOYSAbandonedApr 13, 07Oct 16, 08[B05D, C09D]
2008/0236,619 COBALT CAPPING SURFACE PREPARATION IN MICROELECTRONICS MANUFACTUREAbandonedApr 02, 08Oct 02, 08[C23G]
2008/0116,076 METHOD AND COMPOSITION FOR DIRECT METALLIZATION OF NON-CONDUCTIVE SUBSTRATESAbandonedFeb 08, 07May 22, 08[C23C, C25D]
2007/0178,697 Copper electrodeposition in microelectronicsAbandonedFeb 02, 06Aug 02, 07[H01L]
2007/0131,558 PROCESS FOR DEPOSITION OF CRACK-FREE AND CORROSION-RESISTANT HARD CHROMIUM AND CHROMIUM ALLOY LAYERSAbandonedDec 12, 06Jun 14, 07[C25D]

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